Collection 

Curvilinear and shapeable spintronics

Submission status
Open
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Spintronic devices including memory, logic and sensors are usually fabricated on rigid planar wafers. Extending 2D structures into 3D space relying on the flexible and even printable electronics approaches allows to enrich conventional or to launch novel functionalities of spintronic devices. In particular, geometrically curved and mechanically flexible magnetic architectures offer an entirely new form factor for spintronic elements rendering them mechanically reshapeable and even stretchable, extremely thin and low-weight. This enables their applicability in smart skins and electronic textiles as well as eMobility, virtual and augmented reality, soft robotics, and human-machine interfaces. The presence of geometric curvature in magnetic low-dimensional architectures also results in a plethora of new effects related to the impact of homogeneous and inhomogeneous strain on the performance of spintronic elements, lack of inversion symmetry with the emergence of curvature induced anisotropy and Dzyaloshinskii-Moriya interactions, and spin-orbitronic non-linear transport phenomena. As they stem from the sample geometry, these effects are generic and readily expected not only in ferromagnetic materials but also in 2D magnets, antiferromagnets and altermagnets.

This collection aims to consolidate activities of physicists, material scientists and engineers to explore effects of geometric curvature and related strain in deterministic tailoring of the performance of spintronic devices. As the field is just developing, we seek to publish fundamental research alongside original works describing the fabrication, characterization and application of geometrically curved spintronic devices for flexible, stretchable and printable electronics.

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A close-up of a futuristic, flexible and colorful display being gently held by fingertips

Editors

  • Denys Makarov, PhD

    Helmholtz-Zentrum Dresden-Rossendorf, Germany

  • Run-Wei Li, PhD

    Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, China

  • Carmine Ortix, PhD

    University of Salerno, Italy