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Solido Custom IC at GTS 2025

Solido Custom IC at GTS 2025

The semiconductor industry is an ever-accelerating race, pushing the boundaries of what’s possible with each new process node. On August…

Accelerating Digital Design: New Library Generation and Analysis Flows from Google-Siemens EDA Collaboration at DAC

From rapid library generation to precise analytics, Google and Siemens EDA’s latest collaboration presented at DAC tackles some of the biggest challenges in mobile SoC development.

Forging the Future of Library Verification with AI-Powered Custom IC Design and Verification Solutions

Discover how the powerful collaboration between Samsung Foundry and Siemens EDA has resulted in a groundbreaking methodology to speed up standard cell library verification by 14X over conventional approaches.

Meet the Solido Custom IC Team at DAC 2025

The Solido Custom IC (CIC) team is gearing up for an exciting presence at DAC 2025, where visitors will discover our innovative AI solutions that are transforming the custom IC landscape.

EDA AI panel at the 2025 Siemens EDA User2User conference in Santa Clara, CA. Panelists (from left to right): Ting Ku (Nvidia), Ken Dyer (Microsoft), Karan Singh (AWS), Andrew Ross (AMD), Dan Yu (Siemens EDA), and Jeff Dyck (Siemens EDA).

Blueprint for Achieving Excellence in EDA using AI: Industry Experts Weigh In

This engaging Siemens EDA panel on AI implementation highlighted several key points: AI will enhance human expertise in EDA; while rich EDA data is crucial, it also poses challenges; robust compute infrastructure is essential for AI-driven EDA systems; and the adoption of AI should be swift yet stable

Solido Custom IC Innovation at Intel Foundry Direct Connect 2025

The Solido Custom IC team, alongside colleagues from across Siemens EDA, joined ecosystem partners at Intel Foundry Direct Connect 2025 this April in San Jose.

Heading to DAC 2025 with Thine: Advanced Verification Solutions for ICs to Ensure High Quality Amid PVT Variations

At the center of modern communication systems lies a critical component: the phase interpolator (PI). This relatively tiny component plays…

Siemens’ Solido Custom IC and TSMC Collaborate to Enable Advanced Process Node Verification

After an extensive qualification process, Analog FastSPICE (AFS), part of Solido™ Simulation Suite, has achieved certification for TSMC’s N2P and A16 process nodes. Solido SPICE also achieved qualification for these technology nodes, meeting TSMC’s accuracy requirements.

Heading to DAC 2025 with Microsoft: Novel TRNG Verification with a High-Performance Simulation Methodology

In our data-driven world, the need for robust security solutions continues to grow. At the heart of modern cryptographic systems…