We know even the smallest layers matter. That’s why we’re featuring “seed layer” as this week’s Word of the Week — an ultra-thin film that helps kick off the deposition process and ensures what comes next has a strong foundation.
Lam Research
Semiconductor Manufacturing
Fremont, CA 386,866 followers
Driving semiconductor breakthroughs that define the next generation. Trusted partner of the world’s leading chipmakers.
About us
Lam Research Corp. (NASDAQ:LRCX) At Lam Research, we create equipment that drives technological advancements in the semiconductor industry. Our innovative solutions enable chipmakers to power progress in nearly all aspects of modern life, and it takes each member of our team to make it possible. Across our organization, our employees come to work and change the world. We take on the toughest challenges with precision and accuracy. We push for the next big semiconductor breakthrough. We lead the way in one of the most critical and fast-moving industries on the planet. And we do it together, with deep connections and limitless collaboration. The impact we have on the world is made possible by focusing on our people. We recognize and celebrate our teams’ achievements. We strive to create an inclusive and diverse culture where everyone’s contribution and voice has value. We evaluate and evolve our offerings, so our people receive the support and empowerment to do meaningful things for their lives, careers, and communities. Because at Lam, we believe that when people are the priority and they’re inspired to unleash the power of innovation for a better world together, anything is possible. Ready to help define the future of technology? Join us: www.lamresearch.com/careers
- Website
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http://www.lamresearch.com
External link for Lam Research
- Industry
- Semiconductor Manufacturing
- Company size
- 10,001+ employees
- Headquarters
- Fremont, CA
- Type
- Public Company
- Founded
- 1980
- Specialties
- Semiconductor Manufacturing Equipment, Global Services, Fabrication Technology, Chipmaker Solutions, Microprocessors, and Wafer Processing
Locations
Employees at Lam Research
Updates
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How do you train AI models when data is limited and still improve semiconductor equipment performance? In this session with Semiconductor Engineering, Corporate VP David Fried explains how AI, simulation, and physics-based modeling intersect across scales, from device structures to fab-wide systems. Watch the video to see how teams adapt model strategies to data environments and why industry standards are essential for scaling these tools across the semiconductor ecosystem. 💻 https://bit.ly/419u4yx
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One trillion chips are built every year — and each new generation demands more speed, more power, and less space. Enter molybdenum: the material giving nano-scale interconnects a boost in performance and efficiency. Learn why next-gen tech relies on innovations like this via Semiconductor Engineering. https://bit.ly/4lMhSvO
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Think making a microchip is complicated? It is — and it all starts layer by layer. In deposition, ultra-thin films of material are added to a silicon wafer to build the pathways and insulation that make a chip function. Each method, whether CVD, ALD, or ECD, brings unique precision for different materials and designs. Our Semi 101 blog post shares how we help the world’s leading chipmakers master this step, one layer at a time. Learn more. https://bit.ly/4078QSi
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Every new AI advancement adds pressure to the semiconductor stack — think tighter pitches, deeper features, and faster interconnects. We address these demands head-on with process technologies built for this scale like molybdenum integration without resistive barriers, cryogenic etch with sub-angstrom precision, and deposition solutions designed for next-gen device complexity. Learn more from Corporate VP & GM Dr. Kaihan Ashtiani, Ph.D. in his EE Times | Electronic Engineering Times article. https://bit.ly/4f5YaZM
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We officially joined Bluesky! From Tech Tuesdays to company milestones — follow us to stay connected: https://bit.ly/44EoXZx
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How do you design semiconductor tools that meet performance demands and reduce energy use and emissions? Senior Vice President, Chief Technology and Sustainability Officer Vahid Vahedi shares how we integrate sustainability into our innovation process. From building energy efficiency and emissions reduction into the product design process to using virtual twins and simulation to limit material waste in R&D, we drive measurable impact for our customers and the industry. Read our blog post for a deeper look at the progress and technical challenges ahead. https://bit.ly/3IxDldu
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In today’s edition of Word of the Week, we explore inflection. Every major leap in chipmaking starts with an inflection point — a significant change in process technology that enables the next generation of devices. Think of the shift from aluminum to copper interconnects or the introduction of multiple patterning to continue shrinking features.