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1.An AED can be designed to accommodate a faceplate that can be customized to a customer's wishes to display branding, names, logo or other indicia. Customized faceplates could be ordered on a website that provided templates for customized design. Customized faceplates for AEDs can be used to encourage sponsorship...IPCOM000033874D | 2004-Dec-31
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2.IPCOM000033873D | Original Publication Date: 2004-Dec-31
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3.Disclosed is a solution for a harness-like wearable system that ergonomically facilitates and eases the transportation and use of a computer tablet.IPCOM000033872D | Original Publication Date: 2004-Dec-30
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4.Disclosed is a method that uses a restrainer clip with an optimized force to help reduce package co-planarity during the underfill epoxy cure process. Benefits include a solution that can be modified for a variety of packages.IPCOM000033871D | 2004-Dec-30
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5.Disclosed is a method that embeds higher performance materials and/or substrates into a conventional multilayer PCB. Benefits include being able to alter locally the electrical and mechanical properties of a PCB.IPCOM000033870D | 2004-Dec-30
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6.Disclosed is a method for using an optical fiber to re-direct light down a hole in the PCB. The fiber is severed at a 45o angle, polished, and mirrored to reflect down the severed end of the fiber. Benefits include a solution that eliminates impedance and power issues, and produces less noise than the current state of...IPCOM000033869D | 2004-Dec-30
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7.Disclosed is a method that uses a high-temperature polymer wafer media to process ultra thin wafers through a solder paste machine and a high-convection reflow oven. Benefits include a solution that safeguards the ultra thin wafers from scratches, cracks, and mishandling.IPCOM000033868D | 2004-Dec-30
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8.Disclosed is a method that improves the solder joint strength at the second level interconnects by using micro-fiberglass laid across the pad opening and the SRO.IPCOM000033867D | 2004-Dec-30
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9.Disclosed is a method for a low-friction, fully supported roller assembly for straight line contacts. Benefits include simplifying the assembly process and reducing manufacturing costs.IPCOM000033866D | 2004-Dec-30
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10.Disclosed is a method that provides improved thermal impact resistance for existing ultra high temperature (UHT) trays. Benefits include a solution that can work with a variety of form factors.IPCOM000033865D | 2004-Dec-30