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1.Forward space function via a printer user interface.IPCOM000012359D | Original Publication Date: 2003-Apr-30
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2.The integration of feedback from sensors embedded in a user's chair can be a powerful tool to a computer for the purposes of making appropriate and timely power management decisions.IPCOM000012358D | Original Publication Date: 2003-Apr-30
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3.Described herein is a formal permissions scheme devised for limiting the execution of web browser plug-ins and thereby reducing the occurance of intrusive third-party web content.IPCOM000012357D | Original Publication Date: 2003-Apr-30
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4.Disclosed is a method for the use of a high-density plasma (HDP) multi-layer phosphosilicate glass/undoped silicate glass (PSG/USG) film stack for interlayer dielectric base layer (ILD0) application. Benefits include improved production yields and improved ease of manufacturing.IPCOM000012356D | 2003-Apr-30
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5.Disclosed is a method for message passing by forced link fault on the stack links in the stackable switches. Benefits include improved performance and improved ease of implementation.IPCOM000012355D | 2003-Apr-30
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6.Disclosed is a method for a flexible and scalable Ethernet over synchronous digital hierarchy (SDH), synchronous optical network (SONET) equipment (ITU-T Recommendation X.86 Ethernet Over LAPS), based on an Internet Exchange Processor (IXP) network processor and other Internet Exchange Architecture (IXA) components....IPCOM000012354D | 2003-Apr-30
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7.Disclosed is a method for a Simple Network Management Protocol (SNMP) management information base (MIB) object identifier description (OID) dynamic look-up service. Benefits include improved performance.IPCOM000012353D | 2003-Apr-30
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8.Disclosed is a method for a substrate interposer in a stacked package. Benefits include improved functionality.IPCOM000012352D | 2003-Apr-30
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9.Disclosed is a method for a drop-on-demand unit-level ink mark for flexible tape folded stacked chip scale packages (FSCSP) and molded stacked chip scale packages (SCSP) and very fine-ball grid array (VF-BGA) packages. Benefits include improved yield.IPCOM000012350D | 2003-Apr-30
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10.Disclosed is a method for a flux and solder paste viscosity measurement. Benefits include an improved development environment and improved performance.IPCOM000012349D | 2003-Apr-30